Preventing Damage to Moisture Sensitive Devices (MSDs)

The process of managing and safeguarding the assembly process from environmental influences begins as soon as raw materials are received. Effective management of Electrostatic Discharge (ESD) is established and meticulously outlined. Grounding stations and heel straps are commonly used measures in numerous facilities to mitigate ESD risks. However, ESD management is just one aspect of the broader challenges encountered during assembly.

The effects of humidity on electronic components and Printed Boards (PCBs) are often overlooked. Despite the climate control in most manufacturing environments, moisture can still pose a threat, especially when Moisture Barrier Bags (MBBs) are opened for inspection, inadvertently setting the moisture sensitivity countdown. Once opened, resealing an MBB does not stop the clock, leaving components vulnerable to moisture absorption, which can compromise the longevity of moisture-sensitive devices (MSDs).

Unlike MSDs, bare boards are not subject to stringent moisture control standards. The IPC D-35 subcommittee is addressing this with the IPC-1601 guideline draft for Printed Board Handling and Storage. Currently, without standardized procedures for managing moisture exposure before assembly, manufacturers must independently monitor and mitigate humidity’s impact on these materials.

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